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Advanced Packaging

GlobalFoundries Plans New York Advanced Packaging And Photonics Center

New York Advanced Packaging and Photonics Center
GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center in Malta.
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CHIPS for America Gives U.S. Semiconductor Packaging A $300M Boost

CHIPS for America, Semiconductor Packaging
Projects in Georgia, California, and Arizona aim to strengthen America’s leadership in cutting-edge substrate technology for critical industries like AI.
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Amkor Will Create 2,000 New Jobs In Arizona

In Peoria, AZ, Amkor will invest $2 billion to build what will be the largest outsourced advanced packaging and test facility in the U.S.
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